Methods and Apparatus for Applying Adhesives in Patterns to an Advancing Substrate

ABSTRACT

Methods and apparatuses herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The substrate carrier may include one or more pattern elements and may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, the substrate is disposed on the substrate carrier; the substrate carrier advances the substrate past the slot opening of the slot die applicator. In turn, the substrate is intermittently compressed between the slot die applicator and the pattern surface of the pattern element. As the substrate is intermittently compressed, adhesive discharged from the slot die applicator is applied onto the substrate in an area having a shape substantially the same as a shape defined by the pattern surface.

FIELD OF THE INVENTION

The present disclosure relates to methods and apparatuses utilizingcontinuous substrates for manufacturing articles, and more particularly,methods and apparatuses for applying viscous fluid, such as adhesives,to an advancing substrate.

BACKGROUND OF THE INVENTION

Along an assembly line, various types of articles, such as for example,diapers and other absorbent articles, may be assembled by addingcomponents to and otherwise modifying an advancing, continuous web ofmaterial. For example, in some processes, advancing webs of material arecombined with other advancing webs of material. In other examples,individual components created from advancing webs of material arecombined with advancing webs of material, which in turn, are thencombined with other advancing webs of material. Webs of material andcomponent parts used to manufacture diapers may include: backsheets,topsheet, absorbent cores, front and/or back ears, fastener components,and various types of elastic webs and components such as leg elastics,barrier leg cuff elastics, and waist elastics. Once the desiredcomponent parts are assembled, the advancing web(s) and component partsare subjected to a final knife cut to separate the web(s) into discretediapers or other absorbent articles. The discrete diapers or absorbentarticles may also then be folded and packaged.

Various methods and apparatuses may be used for attaching differentcomponents to the advancing web and/or otherwise modify the advancingweb. For example, some production operations are configured to applyrelatively high viscosity fluids, such as hot melt adhesives, to anadvancing web. In some instances, the production operations areconfigured to apply hot melt adhesives to an advancing web inpre-determined patterns. These operations may include the use of systemsand methods such as slot die coating, direct gravure, offset gravure andreverse gravure roll coating processes that are extensively described inthe art. However, current systems and methods for applying patternedadhesives to an advancing substrate may have certain limitations.

For example, in the manufacture of absorbent articles such as faminehygiene pads, baby diapers, and adult incontinence pads, the use ofgravure coating processes may be confounded by contamination of theimpression cylinders by fibers separated from the substrates to becoated. Some problems associated with gravure cavities and incompletefluid transfer are described, for example, in U.S. Pat. Nos. 7,611,582B2 and 6,003,513. In some instances, slot die coating may be used forpatterned coating of webs in the manufacture of absorbent products. Theuse of combed shims in slot die transfer processes can provide fineresolution and precise transfer of fluid to the receiving substrate inthe axis transverse to the direction of web travel. Such slot transferprocesses may also be configured with electro-pneumatic switching valvesto intermittently transfer adhesive to an advancing substrate. However,the quality and precision of intermittent transfer of fluids to anadvancing substrate may be limited by the speed of the on/off cycle ofswitching valves used to interrupt the flow of fluid to the slot die ofthe fluid applicator. Thus, as web processing speeds increase, theability of current slot die coating methods to achieve fine resolutionof on/off coat patterns in the direction of web travel decreases.

SUMMARY OF THE INVENTION

Aspects of the present disclosure involve methods and apparatuses forapplying fluids onto an advancing substrate. Particular embodiments ofthe apparatuses and methods disclosed herein provide for the applicationof viscous fluids, such as adhesives, and in some embodiments, theapplication of adhesives in pre-determined patterns to an advancingsubstrate. The fluid application apparatus may include a slot dieapplicator and a substrate carrier. The slot die applicator may includea slot opening, a first lip, and a second lip, the slot opening locatedbetween the first lip and the second lip. And the substrate carrier mayinclude one or more pattern elements and may be adapted to advance thesubstrate past the slot die applicator as the slot die applicatordischarges adhesive onto the substrate. In operation, when the firstsurface of the substrate is disposed on the substrate carrier, thesubstrate carrier advances the second surface of the substrate past theslot opening of the slot die applicator. In turn, the substrate isintermittently compressed between the slot die applicator and thepattern surface of the pattern element. As the substrate isintermittently compressed, adhesive discharged from the slot dieapplicator is applied onto the second surface of the advancing substratein an area having a shape that is substantially the same as a shapedefined by the pattern surface.

In one form, an apparatus for applying adhesive in a pattern to anadvancing substrate, wherein the substrate having an unconstrainedcaliper, Hs, and having a first surface disposed opposite of a secondsurface, may include: a slot die applicator including a slot opening, afirst lip, and a second lip, the slot opening located between the firstlip and the second lip; a substrate carrier adapted to advance thesubstrate past the slot die applicator, wherein when the first surfaceof the substrate is disposed on the substrate carrier, the substratecarrier is adapted to advance the second surface of the substrate pastthe slot opening of the slot die applicator. The substrate carrier mayinclude: a base surface; and a pattern element, wherein the patternelement includes a pattern surface, and wherein the pattern elementprotrudes outward from the base surface to define a distance, Hp,between the pattern surface and the base surface. As the substratecarrier advances the second surface of the substrate past the slotopening, the pattern element is advanced such that the pattern surfacerepeatedly advances past the first lip, the slot opening, and the secondlip of the slot die applicator. The substrate carrier is positionedadjacent the slot die applicator to define a minimum distance, Hg,between the pattern surface of the pattern element and the first lip andthe second lip that is less than the unconstrained caliper, Hs, of thesubstrate, wherein a sum of the distance, Hp, and distance, Hg, isgreater than the unconstrained caliper, Hs, of the substrate.

In another form, an apparatus for applying adhesive in a pattern to anadvancing substrate, the substrate having an unconstrained caliper, Hs,and having a first surface disposed opposite of a second surface, mayinclude: a slot die applicator including a slot opening, a first lip,and a second lip, the slot opening located between the first lip and thesecond lip; a substrate carrier adapted to advance the substrate pastthe slot die applicator, wherein when the first surface of the substrateis disposed on the substrate carrier, the substrate carrier is adaptedto advance the second surface of the substrate past the slot opening ofthe slot die applicator. The substrate carrier may include: a patternelement, wherein the pattern surface comprises a continuous patternsurface; and a plurality of holes separated from each other by thepattern element. As the substrate carrier advances the second surface ofthe substrate past the slot opening, the pattern element is advancedsuch that the pattern surface repeatedly advances past the first lip,the slot opening, and the second lip of the slot die applicator. Thesubstrate carrier is positioned adjacent the slot die applicator todefine a minimum distance, Hg, between the pattern surface of thepattern element and the first lip and the second lip that is less thanthe unconstrained caliper, Hs, of the substrate.

In yet another form, a method may apply adhesive discharged from a slotdie applicator to a substrate in a pattern, wherein the slot dieapplicator includes a slot opening, a first lip, and a second lip, theslot opening located between the first lip and the second lip; and thesubstrate includes a first surface disposed opposite of a second surfaceand an unconstrained caliber, Hs. The method may include the steps of:continuously advancing the substrate in a machine direction; engagingthe substrate with a substrate carrier, the substrate carriercomprising: a pattern element, wherein the pattern element includes anpattern surface; positioning the substrate carrier adjacent the slot dieapplicator to define a minimum distance, Hg, between the pattern surfaceof the pattern element and the first lip and the second lip that is lessthan the unconstrained caliper, Hs, of the substrate; advancing thesecond surface of the substrate past the slot die applicator while thefirst surface of the substrate is disposed on the substrate carrier;intermittently compressing the substrate between the slot die applicatorand the pattern surface of the pattern element by advancing the patternelement such that the pattern surface of the pattern element advancespast the first lip, the slot opening, and the second lip of the slot dieapplicator while the first surface of the substrate is disposed on thesubstrate carrier; and discharging adhesive from the slot opening of theslot die applicator onto the second surface of the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a fluid application apparatus positionedadjacent to an advancing substrate.

FIG. 2A is a perspective view of an embodiment of a substrate carrierincluding a pattern roller having a continuous base surface and aplurality of pattern surfaces.

FIG. 2B is a detailed cross-sectional view of the substrate carriershown in FIG. 2A taken along the line 2B-2B.

FIG. 2C is a top side view of a substrate showing a first exampleadhesive pattern thereon.

FIG. 3A is a perspective view of an embodiment of a substrate carrierincluding a pattern roller having a continuous pattern surface andplurality of base surfaces.

FIG. 3B is a detailed cross-sectional view of the substrate carriershown in FIG. 3A taken along the line 3B-3B.

FIG. 3C is a top side view of a substrate showing a second exampleadhesive pattern thereon.

FIG. 3D is a detailed cut-away view of a substrate carrier including acontinuous pattern surface and a plurality of holes.

FIG. 4 is a schematic cross-sectional side view of a fluid applicationapparatus.

FIG. 5A is a detailed cross-sectional view of a substrate carrier and asubstrate advancing past a slot die applicator and showing the substratebetween a slot opening of the slot die applicator and an advancing basesurface.

FIG. 5B is a detailed cross-sectional view of the substrate carrier andsubstrate of FIG. 5A wherein the base surface is advancing past the slotopening of the slot die applicator such the substrate is between theslot opening of the slot die applicator and a leading edge of anadvancing pattern surface.

FIG. 5C is a detailed cross-sectional view of the substrate carrier andsubstrate of FIG. 5B wherein the base surface has advanced past the slotopening of the slot die applicator such that the substrate is betweenthe slot opening of the slot die applicator and an advancing patternsurface.

FIG. 5D is a detailed cross-sectional view of the substrate carrier andsubstrate of FIG. 5C wherein the pattern surface has advanced past theslot opening of the slot die applicator.

FIG. 6 is a schematic cross-sectional side view of an embodiment of afluid application apparatus with a substrate carrier including a patternbelt.

FIG. 7 is a schematic cross-sectional side view of another embodiment ofa fluid application apparatus with a substrate carrier including apattern belt.

FIG. 8 is a schematic cross-sectional side view of another embodiment ofa fluid application apparatus with a substrate carrier including apattern belt and a backup plate.

FIG. 9 is a top plan view of a disposable absorbent article.

DETAILED DESCRIPTION OF THE INVENTION

The following term explanations may be useful in understanding thepresent disclosure: “Absorbent article” is used herein to refer toconsumer products whose primary function is to absorb and retain soilsand wastes. Non-limiting examples of absorbent articles include diapers,training pants, pull-on pant-type diapers, refastenable diapers orpant-type diapers, incontinence briefs and undergarments, diaper holdersand liners, feminine hygiene garments such as panty liners, absorbentinserts, and the like.

“Diaper” is used herein to refer to an absorbent article generally wornby infants and incontinent persons about the lower torso.

The term “disposable” is used herein to describe absorbent articleswhich generally are not intended to be laundered or otherwise restoredor reused as an absorbent article (e.g., they are intended to bediscarded after a single use and may also be configured to be recycled,composted or otherwise disposed of in an environmentally compatiblemanner).

The term “disposed” is used herein to mean that an element(s) is formed(joined and positioned) in a particular place or position as amacro-unitary structure with other elements or as a separate elementjoined to another element.

As used herein, the term “joined” encompasses configurations whereby anelement is directly secured to another element by affixing the elementdirectly to the other element, and configurations whereby an element isindirectly secured to another element by affixing the element tointermediate member(s) which in turn are affixed to the other element.

The term “substrate” is used herein to describe a material which isprimarily two-dimensional (i.e. in an XY plane) and whose thickness (ina Z direction) is relatively small (i.e. 1/10 or less) in comparison toits length (in an X direction) and width (in a Y direction).Non-limiting examples of substrates include a layer or layers or fibrousmaterials, films and foils such as plastic films or metallic foils thatmay be used alone or laminated to one or more web, layer, film and/orfoil. As such, a web is a substrate.

The term “nonwoven” refers herein to a material made from continuous(long) filaments (fibers) and/or discontinuous (short) filaments(fibers) by processes such as spunbonding, meltblowing, and the like.Nonwovens do not have a woven or knitted filament pattern.

The term “machine direction” (MD) is used herein to refer to thedirection of material flow through a process. In addition, relativeplacement and movement of material can be described as flowing in themachine direction through a process from upstream in the process todownstream in the process.

The term “cross direction” (CD) is used herein to refer to a directionthat is generally perpendicular to the machine direction.

The terms “elastic” and “elastomeric” as used herein refer to anymaterial that upon application of a biasing force, can stretch to anelongated length of at least about 110% of its relaxed, original length(i.e. can stretch to 10% more than its original length), without ruptureor breakage, and upon release of the applied force, recovers at leastabout 40% of its elongation. For example, a material that has an initiallength of 100 mm can extend at least to 110 mm, and upon removal of theforce would retract to a length of 106 mm (40% recovery). The term“inelastic” refers herein to any material that does not fall within thedefinition of “elastic” above. The term “extensible” as used hereinrefers to any material that upon application of a biasing force, canstretch to an elongated length of at least about 110% of its relaxed,original length (i.e. can stretch to 10%), without rupture or breakage,and upon release of the applied force, shows little recovery, less thanabout 40% of its elongation.

The terms “activating”, “activation” or “mechanical activation” refer tothe process of making a substrate, or an elastomeric laminate moreextensible than it was prior to the process.

“Live Stretch” includes stretching elastic and bonding the stretchedelastic to a substrate. After bonding, the stretched elastic is releasedcausing it to contract, resulting in a “corrugated” substrate. Thecorrugated substrate can stretch as the corrugated portion is pulled toabout the point that the substrate reaches at least one original flatdimension. However, if the substrate is also elastic, then the substratecan stretch beyond the relaxed length of the substrate prior to bondingwith the elastic. The elastic is stretched at least 25% of its relaxedlength when it is bonded to the substrate.

As used herein, the term “unconstrained caliper” refers to the caliperof the substrate measured according to Edana WSP 120.1 (05), with acircular presser foot having a diameter of 25.40±0.02 mm and an appliedforce of 2.1 N (i.e. a pressure of 4.14±0.21 kPa is applied).

Aspects of the present disclosure involve methods and apparatusesutilizing continuous substrates for manufacturing articles, and moreparticularly, methods and apparatuses for applying fluids onto anadvancing substrate. Particular embodiments of the apparatuses andmethods disclosed herein provide for the application of viscous fluids,such as adhesives, and in some embodiments, the application of adhesivesin pre-determined patterns to an advancing substrate. Embodiments of afluid application apparatus are discussed in more detail below in thecontext of applying adhesives to an advancing substrate having anunconstrained caliper, Hs, and having a first surface disposed oppositeof a second surface. The fluid application apparatus may include a slotdie applicator and a substrate carrier. The slot die applicator mayinclude a slot opening, a first lip, and a second lip, the slot openinglocated between the first lip and the second lip. And the substratecarrier may be adapted to advance the substrate past the slot dieapplicator as the slot die applicator discharges adhesive onto thesubstrate. In operation, when the first surface of the substrate isdisposed on the substrate carrier, the substrate carrier advances thesecond surface of the substrate past the slot opening of the slot dieapplicator. It is to be appreciated that the apparatus and processesdisclosed herein may be used to apply various types of fluids andadhesives in various different patterns to an advancing substrate otherthan those described and depicted herein.

As discussed in more detail below, the substrate carrier may include abase surface and a pattern element. In some embodiments, the substratecarrier may include a plurality of holes therein, and as such, do notinclude base surfaces. The pattern element includes a pattern surfaceand protrudes outward from the base surface. As such, in substratecarriers configured with a base surface, the pattern surface and thebase surface are separated by a distance, Hp. In addition, the substratecarrier is positioned adjacent the slot die applicator to define aminimum distance, Hg, between the pattern surface of the pattern elementand the first lip and the second lip that is less than the unconstrainedcaliper, Hs, of the substrate, wherein a sum of the distance, Hp, anddistance, Hg, is greater than the unconstrained caliper, Hs, of thesubstrate. Thus, as the substrate carrier advances the second surface ofthe substrate past the slot opening, the pattern element is advancedsuch that the pattern surface repeatedly advances past the first lip,the slot opening, and the second lip of the slot die applicator. Inturn, the substrate is intermittently compressed between the slot dieapplicator and the pattern surface of the pattern element as the patternelement advances past the first lip, the slot opening, and the secondlip of the slot die applicator. As the substrate is intermittentlycompressed, adhesive discharged from the slot die applicator is appliedonto the second surface of the advancing substrate. More particularly,the adhesive is applied to the substrate in an area having a shape thatis substantially the same as a shape defined by the pattern surface.

The apparatuses and methods disclosed herein may include substratecarriers having various configurations. For example, in some embodimentsthe substrate carrier may be configured as a roller. In otherembodiments, the substrate carrier may include an endless belt. Thesubstrate carriers may also utilize various outer surface arrangements.For example, the base surface may be configured as a continuous surfaceand the substrate carrier may include a plurality of discrete patternelements separated from each other by the continuous surface. In such aconfiguration, each pattern element may include a pattern surface andeach pattern element may protrude outward from the continuous surfacesuch that each pattern surface is separated from the continuous surfaceby the distance, Hp. In another example, the pattern surface may beconfigured as a continuous surface and the base surface may include aplurality of discrete base surfaces separated from each other by thepattern element. In such a configuration, the pattern element mayprotrude outward from each of the base surfaces such that each basesurface is separated from the continuous surface by the distance, Hp. Aspreviously mentioned, in some configurations, the substrate carrier maybe configured without base surfaces, such as for example, a beltconfigured with holes extending through the belt. As such, the holes maybe separated from each other by a continuous pattern element. It is tobe appreciated that the pattern surface of the pattern element may beconfigured in various different shapes and sizes and may be configuredto define various different patterns. As such, adhesive may betransferred from the slot die applicator to define various patterns on asubstrate.

As mentioned above, apparatuses and methods of the present disclosuremay be utilized to apply adhesives to continuous substrates used in themanufacture of absorbent articles. Such substrates may be utilized inabsorbent article components such as, for example: backsheets,topsheets, absorbent cores, front and/or back ears, fastener components,and various types of elastic webs and components such as leg elastics,barrier leg cuff elastics, and waist elastics. Exemplary descriptions ofabsorbent article components and substrates are provided below withreference to FIG. 9. In addition, substrates may include continuous websof material and component parts mounted on carrier substrates or may bein the form of a continuous substrate.

Although much of the present disclosure is provided in the context ofmanufacturing absorbent articles, it is to be appreciated that theapparatuses and methods disclosed herein may be applied to themanufacture of other types of articles and products manufactured fromcontinuous substrates. Examples of other products include absorbentarticles for inanimate surfaces such as consumer products whose primaryfunction is to absorb and retain soils and wastes that may be solid orliquid and which are removed from inanimate surfaces such as floors,objects, furniture and the like. Non-limiting examples of absorbentarticles for inanimate surfaces include dusting sheets, pre-moistenedwipes or pads, pre-moistened cloths, paper towels, dryer sheets anddry-cleaning clothes such. Additional examples of products includeabsorbent articles for animate surfaces whose primary function is toabsorb and contain body exudates and, more specifically, devices whichare placed against or in proximity to the body of the user to absorb andcontain the various exudates discharged from the body. Non-limitingexamples of incontinent absorbent articles include diapers, training andpull-on pants, adult incontinence briefs and undergarments, femininehygiene garments such as panty liners, absorbent inserts, and the like,toilet paper, tissue paper, facial wipes or clothes, and toilet trainingwipes. Still other examples of products may include packaging componentsand substrates and/or containers for laundry detergent and coffee, whichmay be produced in pellets or pouches and may be manufactured in aconverting or web process or even discreet products produced at highspeed such as high-speed bottling lines, cosmetics, razor bladecartridges, and disposable consumer batteries.

FIG. 1 shows a perspective view an embodiment of an apparatus 100 forapplying adhesives to a substrate. The apparatus 100 includes a slot dieapplicator 102 and a substrate carrier 104. As shown in FIG. 1, asubstrate 106 is advancing in a machine direction and is partiallywrapped around the substrate carrier 104. More particularly, thesubstrate 106 includes a first surface 108 disposed opposite a secondsurface 110. And the first surface 108 of the substrate 106 is disposedon an outer surface 112 of the substrate carrier 104 while the secondsurface 110 of the substrate 106 advances past the slot die applicator104. As discussed in more detail below, the second surface 110 of thesubstrate 106 advances past the slot die applicator 104 and adhesive istransferred from the slot die applicator 102 onto the second surface ofthe substrate in a pattern that is substantially the same as a patterndefined on the outer surface 112 of the substrate carrier 104.

It is to be appreciated that the slot die applicator 102 shown in FIG. 1is a generic representation of a device that is used to apply adhesiveto the substrate 106. The slot die applicator may include a slot opening114, a first lip 116, and a second lip 118. The first lip 116 may alsobe referred to herein as an upstream die lip, and the second lip 118 mayalso be referred to herein as a downstream die lip. The slot opening 114is located between the first lip 116 and the second lip 118. Adhesive orother fluid may be discharged from the slot opening 114 onto the secondsurface 110 of the substrate 106 as the substrate carrier 104 advancesthe substrate past the first lip 116, slot opening 114, and second lip118 of the slot die applicator 102. As discussed in more detail below,the substrate 106 is also intermittently compressed between the slot dieapplicator 102 and substrate carrier 104 as the substrate 106 advancespast the slot die applicator 102. It is to be appreciated that variousforms of slot die applicators may be used herein to apply adhesive orother fluids to an advancing substrate according to methods andapparatuses. For example, U.S. Pat. No. 7,056,386 provides a descriptionof slot die applicators that may be used. Other examples of commerciallyavailable slot die applicators include Nordson Corporation's EP11 Seriesof Slot Die Applicators and ITW Dynatec Gmbh's APEX Series of Slot DieAuto Adhesive Applicators.

Various types of substrate carriers 104 may be used in accordance withthe apparatuses and methods herein. For example, FIGS. 2A and 2B show anembodiment of a substrate carrier 104 configured as a roller 120 adaptedto advance a substrate 106 past the slot die applicator 102. The outersurface 112 of the substrate carrier 104 shown in FIGS. 2A and 2Bincludes a plurality of pattern elements 122 that protrude radiallyoutward from a base surface 124. Each pattern element 122 includes apattern surface 126, and the radial protrusion of the pattern elements122 from the base surface 124 define a distance, Hp, between the patternsurface 126 and the base surface 124. As shown in FIGS. 2A and 2B, thebase surface 124 is configured as a continuous surface 128, and theplurality of discrete pattern elements 122 are separated from each otherby the continuous surface 128. The pattern surfaces 126 in FIGS. 2A and2B define a diamond shape. In some embodiments, the shape and size ofthe pattern surface 126 of each pattern element 122 may be identical orsubstantially identical to each other. It is to be appreciated that thenumber, size, and shape of some or all the pattern surfaces and/orpattern elements may be different. In addition, the distance, Hp,between the base surface 124 and the pattern surface 126 of the patternelement 122 may be the same or different for some or all of the patternelements.

As discussed in more detail below, as the substrate carrier 104 advancesthe substrate 106 past the slot die applicator 102, fluid dischargedfrom the slot die applicator is deposited onto the substrate in apattern substantially matching the shapes of the pattern surfaces on thesubstrate carrier. For example, FIG. 2C shows an example pattern offluid 130 deposited on a second surface 110 of a substrate 106 afterbeing advanced past a slot die applicator while disposed on a substratecarrier having pattern elements 122 and pattern surfaces 126 similar tothose shown in FIGS. 2A and 2B. As shown in FIG. 2C, the fluid 130 isdeposited onto the substrate 106 in discrete pattern areas 132 havingdiamond shapes that correspond with the shapes of the pattern surfaces126 on the substrate carrier 104 shown in FIG. 2A.

FIGS. 3A and 3B show another embodiment of a substrate carrier 104configured as a roller 120 adapted to advance a substrate 106 past theslot die applicator 102. The substrate carrier 104 shown in FIGS. 3A and3B includes a single pattern element 122 including a pattern surface126. And the pattern element 122 protrudes radially outward from aplurality of base surfaces 124. More particularly, the pattern surface126 is configured as a continuous surface 134 and the plurality of basesurfaces are separated from each other by the pattern element 122. Theradial protrusion of the pattern element 122 from the base surfaces 124defines a distance, Hp, between the pattern surface 126 and the basesurfaces 124. The pattern surface 126 in FIGS. 3A and 3B defines acontinuous crossing line pattern wherein the shape and size of each basesurface 124 are identical or substantially identical to each other. Itis to be appreciated that the number, size, and shape of some or all thebase surfaces may be different. In addition, the distance, Hp, betweenthe base surfaces 124 and the pattern surface 126 of the pattern element122 may be the same or different for some or all of the base surfaces.It should also be appreciated that the substrate carrier may beconfigured without base surfaces. For example, the substrate carrier mayinclude a plurality of holes and the pattern surface may be configuredas a continuous surface wherein the plurality of holes are separatedfrom each other by the pattern element. For example, FIG. 3D shows adetailed view of a substrate carrier embodiment wherein a plurality ofholes 136 are separated from each other by a pattern element 122 havinga continuous pattern surface 126. Because the substrate carrier 104 ofFIG. 3D does not have base surfaces, a distance, Hp, is not defined.

As previously mentioned, as the substrate carrier 104 advances thesubstrate 106 past the slot die applicator 102, fluid 130 dischargedfrom the slot die applicator 102 is deposited onto the substrate 106 ina pattern substantially matching the shape of the pattern surface 126 onthe substrate carrier 104. For example, FIG. 3C shows an example patternof fluid 130 deposited on a second surface 110 of a substrate 106 afterbeing advanced past a slot die applicator 102 while disposed on asubstrate carrier 104 having a pattern element 122 and pattern surface126 similar to that shown in FIGS. 3A, 3B, and 3D. As shown in FIG. 3C,the fluid 130 is deposited onto the substrate 106 in a crossing linepattern defining diamond shapes therebetween that correspond with theshapes of the base surfaces 124 and holes 136 on the substrate carrier104 shown in FIGS. 3A and 3D, respectively.

As previously mentioned, the methods and apparatuses herein include asubstrate carrier adapted to advance a substrate past a slot dieapplicator. FIG. 4 shows a schematic cross-sectional side view of anembodiment of a fluid application apparatus 100 including a substratecarrier 104 and a slot die applicator 102. The substrate 106 includes afirst surface 108 and a second surface 110 disposed opposite the firstsurface 108. A portion of the first surface 108 of the substrate 106 isdisposed on the substrate carrier 104, which is configured as a roller120 having a plurality of pattern elements 122 protruding from aplurality of base surfaces 124. The roller 120 rotates to advance thesecond surface 110 of the substrate 106 past the slot die applicator102. A fluid delivery system 138 may be used to supply fluid 130, suchas an adhesive, to the slot die applicator 102. It is to be appreciatedthat the fluid delivery system may be configured in various differentways. For example, as shown in FIG. 4, the fluid delivery system 138 mayinclude a pump 140 to move fluid from a tank 142 to the slot dieapplicator 102. The fluid delivery system 138 may also be configuredwith a pressure relief valve 144 configured to help control the pressureof the fluid 130 fed from the pump 140. Fluid 130 from the fluiddelivery system 138 passes through the slot die applicator 102 and slotopening 114 and is transferred to the second surface 110 of theadvancing substrate 106.

With continued reference to FIG. 4, fluid 130 passing from the slot dieapplicator 102 is transferred to the second surface 110 of the substrate106 in a pattern or shape that is substantially the same as the patternsurfaces 126 on the substrate carrier 104. As discussed in more detailbelow, the substrate carrier 104 is positioned adjacent the slot dieapplicator 102 to define a minimum distance between the pattern surface126 and slot die applicator 102, which is less than the unconstrainedcaliper of the substrate 106. As such, the substrate 106 is compressedbetween the slot die applicator 102 and the pattern surface 126 of thepattern element 122 as the pattern element advances past the first lip116, the slot opening 114, and the second lip 118 of the slot dieapplicator 102. However, the minimum distance between the base surface124 of the substrate carrier 104 and the slot die applicator 102 isgreater than the unconstrained caliper of the substrate 106. As such,the substrate 106 is not compressed between the slot die applicator 102and the base surface 124 as the substrate advances past the first lip116, the slot opening 114, and the second lip 118 of the slot dieapplicator 102. Thus, in operation, although fluid 130 is continuouslydischarged from the slot die applicator 102, fluid 130 is transferred tothe advancing substrate 106 when the substrate is compressed as patternsurfaces 126 on the substrate carrier 102 advance past the slot dieopening 114 and compress the substrate. And fluid 130 is not transferredto the advancing substrate 106 when the substrate is uncompressed whilebase surfaces 124 on the substrate carrier 104 advance past the slot dieopening 114. With regard to substrate carriers configured with holes136, as opposed to base surfaces, fluid 130 is not transferred to theadvancing substrate 106 when the substrate is uncompressed while holes136 on the substrate carrier 104 advance past the slot die opening 114.The following provides a more detailed description of fluid transferfrom the slot die applicator to the substrate with reference to FIGS. 5Athrough 5D.

FIG. 5A is a detailed cross-sectional view of a substrate carrier 104and a substrate 106 advancing past a slot die applicator 102. Thesubstrate 106 has an unconstrained caliper, Hs, and has a first surface108 disposed opposite of a second surface 110. The first surface 108 ofthe substrate 106 is disposed on the substrate carrier 104. And thesubstrate 106 and substrate carrier 104 are shown as advancing togetherin a machine direction, MD, past the slot die applicator 102. Moreparticularly, the second surface 110 of the substrate 106 is advancingpast a slot opening 114 located between an upstream lip 116 and adownstream lip 118 of the slot die applicator 104.

As shown in FIG. 5A, the substrate carrier 104 includes a base surface124 and a pattern element 122 protruding from base surface 124. Thepattern element 122 protrudes outward from the base surface 124 todefine a distance, Hp, between the pattern surface 126 and the basesurface 124. The substrate carrier 104 is also positioned adjacent theslot die applicator 104 to define a minimum distance, Hg, between thepattern surface 124 of the pattern element 122 and the first lip 116 andthe second lip 118 that is less than the unconstrained caliper, Hs, ofthe substrate 106. In addition, the substrate carrier 104 is positionedadjacent the slot die applicator 102 to define a minimum distance, Hb,between the base surface 124 and the first lip 116 and the second lip118 that is greater than the unconstrained caliper, Hs, of thesubstrate. The apparatus 100 may also be configured such that a sum ofthe distance, Hp, and distance, Hg, is greater than the unconstrainedcaliper, Hs, of the substrate 106. Thus, a portion 106 a of thesubstrate 106 that is located between the slot opening 114 of the slotdie applicator 104 and the advancing base surface 124 is not compressed.As such, although fluid 130 is continuously discharged from the slotopening 114, fluid 130 is not being transferred to the second surface110 of the substrate 104.

FIG. 5B is a detailed cross-sectional view of the substrate carrier 104and substrate 106 of FIG. 5A wherein the base surface 124 has advancedpast the slot opening 114 of the slot die applicator 104 such that aportion 106 b of the substrate 106 is between the first lip 116 of theslot die applicator 104 and a leading edge 146 of an advancing patternsurface 126. As previously discussed, the minimum distance, Hg, betweenthe pattern surface 126 of the pattern element 122 and the first lip 116and the second lip 118 is less than the unconstrained caliper, Hs, ofthe substrate 106. As such, a portion 106 b of substrate 106 between thepattern surface 126 and the first lip 116 is compressed. The fluid 130being discharged from the slot opening 114 is shown in FIG. 5B asbeginning to transfer to the second surface 110 of the substrate as theleading edge 146 of the pattern surface 126 and adjacent compressedportion 106 b of the substrate 106 begin to advance past the slotopening 114.

FIG. 5C is a detailed cross-sectional view of the substrate carrier 104and substrate of FIG. 5B wherein the base surface 124 and leading edge146 of the pattern surface 126 has advanced past the slot opening 114 ofthe slot die applicator 104 such that a portion 106 b of the advancingsubstrate 106 is between the slot opening 114 of the slot die applicator104 and an advancing pattern surface 126. Because the minimum distance,Hg, between the pattern surface 126 of the pattern element 122 and thefirst lip 116 and the second lip 118 is less than the unconstrainedcaliper, Hs, of the substrate 106, a portion 106 b of substrate 106between the pattern surface 126 and the first lip 116 and second lip 118of the slot die applicator 104 is compressed. The fluid 130 beingdischarged from the slot opening 114 is shown in FIG. 5C as beingtransferred to the second surface 110 of the substrate as the patternsurface 126 and adjacent compressed portion 106 b of the substrate 106advance past the slot opening 114.

FIG. 5D is a detailed cross-sectional view of the substrate carrier 104and substrate 106 of FIG. 5C wherein the pattern surface 126 hasadvanced past the slot opening 114 of the slot die applicator 104. Assuch, a portion 106 b of the advancing substrate 106 is between the slotopening 114 of the slot die applicator 104 and an advancing base surface124. Because the minimum distance, Hb, between the base surface 124 andthe first lip 116 and the second lip 118 that is greater than theunconstrained caliper, Hs, of the substrate, a portion of substrate 106between the base surface 124, slot opening 114, and the first lip 116 ofthe slot die applicator 104 is uncompressed. As such, the fluid 130being discharged from the slot opening 114 is shown in FIG. 5D asceasing to be transferred to the second surface 110 of the substrate 106as the base surface 124 and adjacent uncompressed portion of thesubstrate advance past the slot opening 114.

As previously mentioned, various forms and configurations of substratecarriers may be used with the presently disclosed methods andapparatuses. For example, FIG. 6 shows a schematic cross-sectional sideview of an embodiment of a fluid application apparatus 100 with asubstrate carrier 104 including an endless pattern belt 148. The patternbelt 148 is wrapped around two rollers 150 adapted to advance patternbelt 148 and substrate past the slot die applicator 102. The patternbelt 148 may include various different combinations, shapes, and typesof pattern elements 122 and base surfaces 124 and/or holes 136 asprevious described. As shown in FIG. 6, the slot die applicator 102 isadjacent the pattern belt 148 at a location where the pattern belt 148is partially wrapped around one of the rollers 150. It is to beappreciated that the slot die applicator 102 may be located adjacentother locations of the pattern belt 148. For example, FIG. 7 shows aschematic cross-sectional side view of an embodiment of a fluidapplication apparatus 100 wherein the slot die applicator 102 isadjacent the pattern belt 148 at a location between the rollers 150. AndFIG. 8 shows a schematic cross-sectional side view of the embodiment ofFIG. 7 with a backup plate 152 located behind the pattern belt 148,wherein the backup plate 148 provides support to the pattern belt 148 tohelp prevent the pattern belt from deflecting away from the slot dieapplicator 102.

With reference to the above description and associated figures, it is tobe appreciated that the apparatuses 100 herein may be used to applyadhesive 130 discharged from a slot die applicator 102 to a substrate106 in a pattern by continuously advancing the substrate in a machinedirection past a first lip 116, second lip 118, and slot opening 114 inthe slot die applicator 102. The substrate 106 may be engaged with asubstrate carrier 104 that may include a base surface 124 and a patternelement 122, wherein the pattern element includes a pattern surface 126.The pattern element 122 protrudes from the base surface 124 to define adistance, Hp, between the pattern surface 126 and the base surface 124.As previously mentioned, in some embodiments, the substrate carrier mayinclude holes 136 instead of or in combination with base surfaces 126adjacent the pattern element 122. The substrate carrier 104 ispositioned adjacent the slot die applicator 102 to define a minimumdistance, Hg, between the pattern surface 126 of the pattern element 122and the first lip 116 and the second lip 118 that is less than theunconstrained caliper, Hs, of the substrate 106. The second surface 110of the substrate 106 may be advanced past the slot die applicator 102while the first surface 108 of the substrate 106 is disposed on thesubstrate carrier 104. And the substrate 106 is intermittentlycompressed between the slot die applicator 102 and the pattern surface126 of the pattern element 122 by advancing the pattern element as thepattern surface of the pattern element advances past the first lip 116,the slot opening 114, and the second lip 118 of the slot die applicator102 while the first surface 108 of the substrate 106 is disposed on thesubstrate carrier 104.

As previously mentioned, the apparatuses 100 and methods herein may beused to provide for the application of adhesives in patterns tosubstrates and components during the manufacture of various differentproducts. For the purposes of a specific illustration, FIG. 9 shows oneexample of a disposable absorbent article 250, such as described in U.S.Patent Publication No. US2008/0132865 A1, in the form of a diaper 252that may be constructed from such substrates and components manipulatedduring manufacture according to the apparatuses and methods disclosedherein. In particular, FIG. 9 is a plan view of one embodiment of adiaper 252 including a chassis 254 shown in a flat, unfolded condition,with the portion of the diaper 252 that faces a wearer oriented towardsthe viewer. A portion of the chassis structure is cut-away in FIG. 9 tomore clearly show the construction of and various features that may beincluded in embodiments of the diaper.

As shown in FIG. 9, the diaper 252 includes a chassis 254 having a firstear 256, a second ear 258, a third ear 260, and a fourth ear 262. Toprovide a frame of reference for the present discussion, the chassis isshown with a longitudinal axis 264 and a lateral axis 266. The chassis254 is shown as having a first waist region 268, a second waist region270, and a crotch region 272 disposed intermediate the first and secondwaist regions. The periphery of the diaper is defined by a pair oflongitudinally extending side edges 274, 276; a first outer edge 278extending laterally adjacent the first waist region 268; and a secondouter edge 280 extending laterally adjacent the second waist region 270.As shown in FIG. 9, the chassis 254 includes an inner, body-facingsurface 282, and an outer, garment-facing surface 284. A portion of thechassis structure is cut-away in FIG. 9 to more clearly show theconstruction of and various features that may be included in the diaper.As shown in FIG. 9, the chassis 254 of the diaper 252 may include anouter covering layer 286 including a topsheet 288 and a backsheet 290.An absorbent core 292 may be disposed between a portion of the topsheet288 and the backsheet 290. As discussed in more detail below, any one ormore of the regions may be stretchable and may include an elastomericmaterial or laminate as described herein. As such, the diaper 252 may beconfigured to adapt to a specific wearer's anatomy upon application andto maintain coordination with the wearer's anatomy during wear.

The absorbent article may also include an elastic waist feature 202shown in FIG. 9 in the form of a waist band 294 and may provide improvedfit and waste containment. The elastic waist feature 202 may beconfigured to elastically expand and contract to dynamically fit thewearer's waist. The elastic waist feature 202 can be incorporated intothe diaper in accordance with the methods discussed herein and mayextend at least longitudinally outwardly from the absorbent core 292 andgenerally form at least a portion of the first and/or second outer edges278, 280 of the diaper 252. In addition, the elastic waist feature mayextend laterally to include the ears. While the elastic waist feature202 or any constituent elements thereof may comprise one or moreseparate elements affixed to the diaper, the elastic waist feature maybe constructed as an extension of other elements of the diaper, such asthe backsheet 290, the topsheet 288, or both the backsheet and thetopsheet. In addition, the elastic waist feature 202 may be disposed onthe outer, garment-facing surface 284 of the chassis 240; the inner,body-facing surface 282; or between the inner and outer facing surfaces.The elastic waist feature 202 may be constructed in a number ofdifferent configurations including those described in U.S. Pat. No.7,432,413; U.S. Patent Publication No. 2007/0142798; and U.S. PatentPublication No. 2007/0287983; all of which are hereby incorporated byreference herein.

As shown in FIG. 9, the diaper 252 may include leg cuffs 296 that mayprovide improved containment of liquids and other body exudates. Inparticular, elastic gasketing leg cuffs can provide a sealing effectaround the wearer's thighs to prevent leakage. It is to be appreciatedthat when the diaper is worn, the leg cuffs may be placed in contactwith the wearer's thighs, and the extent of that contact and contactpressure may be determined in part by the orientation of diaper on thebody of the wearer. The leg cuffs 296 may be disposed in various ways onthe diaper 202.

The diaper 252 may be provided in the form of a pant-type diaper or mayalternatively be provided with a re-closable fastening system, which mayinclude fastener elements in various locations to help secure the diaperin position on the wearer. For example, fastener elements may be locatedon the first and second ears and may be adapted to releasably connectwith one or more corresponding fastening elements located in the secondwaist region. It is to be appreciated that various types of fasteningelements may be used with the diaper.

In the context of the previous discussion, the apparatuses 100 andmethods herein may be used to provide for the application adhesives inpatterns to substrates and components during the manufacture of anabsorbent article. For example, adhesives may be applied in variouspatterns to portions of any of the topsheet, backsheet, absorbent core,leg cuffs, waist feature, ears, and fastening elements during themanufacture of an absorbent article. In some instances, the adhesive maybe a different color than that of the substrate.

The dimensions and values disclosed herein are not to be understood asbeing strictly limited to the exact numerical values recited. Instead,unless otherwise specified, each such dimension is intended to mean boththe recited value and a functionally equivalent range surrounding thatvalue. For example, a dimension disclosed as “40 mm” is intended to mean“about 40 mm.”

Every document cited herein, including any cross referenced or relatedpatent or application, is hereby incorporated herein by reference in itsentirety unless expressly excluded or otherwise limited. The citation ofany document is not an admission that it is prior art with respect toany invention disclosed or claimed herein or that it alone, or in anycombination with any other reference or references, teaches, suggests ordiscloses any such invention. Further, to the extent that any meaning ordefinition of a term in this document conflicts with any meaning ordefinition of the same term in a document incorporated by reference, themeaning or definition assigned to that term in this document shallgovern.

While particular embodiments of the present invention have beenillustrated and described, it would be obvious to those skilled in theart that various other changes and modifications can be made withoutdeparting from the spirit and scope of the invention. It is thereforeintended to cover in the appended claims all such changes andmodifications that are within the scope of this invention.

What is claimed is:
 1. An absorbent article comprising: a chassiscomprising: an inner, body-facing surface; an outer, garment-facingsurface; a first waist region; a second waist region; and a crotchregion disposed intermediate the first and second waist regions; and apair of longitudinally extending side edges; a first outer edgeextending laterally adjacent the first waist region; a second outer edgeextending laterally adjacent the second waist region; a substrateincluding a first surface disposed opposite of a second surface and anunconstrained caliber, Hs; and adhesive discharged directly from a slotdie applicator onto the second surface of the substrate in an areahaving a shape that is substantially the same as a shape defined by apattern surface that is positioned a minimum distance, Hg, from the slotdie applicator, wherein that is less than the unconstrained caliper, Hs,of the substrate.
 2. The absorbent article of claim 1, furthercomprising a backsheet, wherein the backsheet includes the substrate. 3.The absorbent article of claim 1, further comprising a backsheet, andwherein the substrate is a topsheet connected with the backsheet.
 4. Theabsorbent article of claim 1, further comprising a topsheet; a backsheetconnected with the topsheet; an absorbent core interposed between thebacksheet and the topsheet; and wherein the absorbent core includes thesubstrate.
 5. The absorbent article of claim 1, further comprising anelastic waist feature, wherein the elastic waist feature includes thesubstrate.
 6. The absorbent article of claim 1, further comprising a legcuff, wherein the leg cuff includes the substrate.
 7. The absorbentarticle of claim 1, further comprising a fastening element, wherein thefastening element includes the substrate.
 8. The absorbent article ofclaim 1, wherein the adhesive and the substrate are different colors. 9.The absorbent article of claim 1, wherein the substrate comprises anonwoven.